84561090 (01/1998-12/2006) Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. those of a kind used in the manufacture of semiconductor wafers or devices, soldering and welding machines, incl. those which can be used for cutting, and material testing machines)

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CN 84561090 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: France / Reporter: European Union /84561090:Machine Tools for Working any Material by Removal of Material, Operated by Laser or Other Light or Photon Beam Processes (Excl. Those of a Kind Used in the Manufacture of Semiconductor Wafers or Devices, Soldering and Welding Machines, Incl. Those Which can be Used for Cutting, and Material Testing Machines)
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CN 84561090 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: Belgium/ Luxembourg / Reporter: European Union /84561090:Machine Tools for Working any Material by Removal of Material, Operated by Laser or Other Light or Photon Beam Processes (Excl. Those of a Kind Used in the Manufacture of Semiconductor Wafers or Devices, Soldering and Welding Machines, Incl. Those Which can be Used for Cutting, and Material Testing Machines)
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CN 84561090 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: Netherlands / Reporter: European Union /84561090:Machine Tools for Working any Material by Removal of Material, Operated by Laser or Other Light or Photon Beam Processes (Excl. Those of a Kind Used in the Manufacture of Semiconductor Wafers or Devices, Soldering and Welding Machines, Incl. Those Which can be Used for Cutting, and Material Testing Machines)
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CN 84561090 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: Germany / Reporter: European Union /84561090:Machine Tools for Working any Material by Removal of Material, Operated by Laser or Other Light or Photon Beam Processes (Excl. Those of a Kind Used in the Manufacture of Semiconductor Wafers or Devices, Soldering and Welding Machines, Incl. Those Which can be Used for Cutting, and Material Testing Machines)
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CN 84561090 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: Italy / Reporter: European Union /84561090:Machine Tools for Working any Material by Removal of Material, Operated by Laser or Other Light or Photon Beam Processes (Excl. Those of a Kind Used in the Manufacture of Semiconductor Wafers or Devices, Soldering and Welding Machines, Incl. Those Which can be Used for Cutting, and Material Testing Machines)
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CN 84561090 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: United Kingdom / Reporter: European Union /84561090:Machine Tools for Working any Material by Removal of Material, Operated by Laser or Other Light or Photon Beam Processes (Excl. Those of a Kind Used in the Manufacture of Semiconductor Wafers or Devices, Soldering and Welding Machines, Incl. Those Which can be Used for Cutting, and Material Testing Machines)
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CN 84561090 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: Ireland / Reporter: European Union /84561090:Machine Tools for Working any Material by Removal of Material, Operated by Laser or Other Light or Photon Beam Processes (Excl. Those of a Kind Used in the Manufacture of Semiconductor Wafers or Devices, Soldering and Welding Machines, Incl. Those Which can be Used for Cutting, and Material Testing Machines)
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CN 84561090 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: Denmark / Reporter: European Union /84561090:Machine Tools for Working any Material by Removal of Material, Operated by Laser or Other Light or Photon Beam Processes (Excl. Those of a Kind Used in the Manufacture of Semiconductor Wafers or Devices, Soldering and Welding Machines, Incl. Those Which can be Used for Cutting, and Material Testing Machines)
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