84642005 (01/1995-12/2006) Grinding and polishing machines for working semiconductor wafers

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CN 84642005 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: France / Reporter: European Union /84642005:Grinding and Polishing Machines for Working Semiconductor Wafers
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CN 84642005 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: Netherlands / Reporter: European Union /84642005:Grinding and Polishing Machines for Working Semiconductor Wafers
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CN 84642005 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: Germany / Reporter: European Union /84642005:Grinding and Polishing Machines for Working Semiconductor Wafers
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CN 84642005 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: Italy / Reporter: European Union /84642005:Grinding and Polishing Machines for Working Semiconductor Wafers
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CN 84642005 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: United Kingdom / Reporter: European Union /84642005:Grinding and Polishing Machines for Working Semiconductor Wafers
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CN 84642005 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: Ireland / Reporter: European Union /84642005:Grinding and Polishing Machines for Working Semiconductor Wafers
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CN 84642005 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: Denmark / Reporter: European Union /84642005:Grinding and Polishing Machines for Working Semiconductor Wafers
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CN 84642005 / Exports / Unit = Prices (Euro/ suppl. units) / Partner: Greece / Reporter: European Union /84642005:Grinding and Polishing Machines for Working Semiconductor Wafers
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