84771090 (01/1998-12/2006) Injection-moulding machines for working rubber or plastics (excl. encapsulation equipment for assembly of semiconductor devices)

Source: Eurostat, Luxembourg

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CN 84771090 / Exports / Unit = Prices (Euro/ ton) / Partner: France / Reporter: European Union /84771090:Injection-moulding Machines for Working Rubber or Plastics (Excl. Encapsulation Equipment for Assembly of Semiconductor Devices)
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CN 84771090 / Exports / Unit = Prices (Euro/ ton) / Partner: Belgium/ Luxembourg / Reporter: European Union /84771090:Injection-moulding Machines for Working Rubber or Plastics (Excl. Encapsulation Equipment for Assembly of Semiconductor Devices)
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CN 84771090 / Exports / Unit = Prices (Euro/ ton) / Partner: Netherlands / Reporter: European Union /84771090:Injection-moulding Machines for Working Rubber or Plastics (Excl. Encapsulation Equipment for Assembly of Semiconductor Devices)
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CN 84771090 / Exports / Unit = Prices (Euro/ ton) / Partner: Germany / Reporter: European Union /84771090:Injection-moulding Machines for Working Rubber or Plastics (Excl. Encapsulation Equipment for Assembly of Semiconductor Devices)
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CN 84771090 / Exports / Unit = Prices (Euro/ ton) / Partner: Italy / Reporter: European Union /84771090:Injection-moulding Machines for Working Rubber or Plastics (Excl. Encapsulation Equipment for Assembly of Semiconductor Devices)
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CN 84771090 / Exports / Unit = Prices (Euro/ ton) / Partner: United Kingdom / Reporter: European Union /84771090:Injection-moulding Machines for Working Rubber or Plastics (Excl. Encapsulation Equipment for Assembly of Semiconductor Devices)
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CN 84771090 / Exports / Unit = Prices (Euro/ ton) / Partner: Ireland / Reporter: European Union /84771090:Injection-moulding Machines for Working Rubber or Plastics (Excl. Encapsulation Equipment for Assembly of Semiconductor Devices)
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CN 84771090 / Exports / Unit = Prices (Euro/ ton) / Partner: Denmark / Reporter: European Union /84771090:Injection-moulding Machines for Working Rubber or Plastics (Excl. Encapsulation Equipment for Assembly of Semiconductor Devices)
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