Source: Eurostat, Luxembourg
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CN 84799050 / Exports / Unit = Prices (Euro/ ton) / Partner: France / Reporter: European Union /84799050:Parts of Apparatus for Growing or Pulling Monocrystal Semiconductor Boules, Apparatus for Epitaxial Deposition on Semiconductor Wafers, Apparatus for wet Etching, Developing, Stripping or Cleaning Semiconductor Wafers or of Flat Panel Display Substrates, die Attach Apparatus and Tape Automated Bonders for Assembly of Semiconductor Devices and Encapsulation Equipment for Assembly of Semiconductor Devices, N.e.s. |
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CN 84799050 / Exports / Unit = Prices (Euro/ ton) / Partner: Belgium/ Luxembourg / Reporter: European Union /84799050:Parts of Apparatus for Growing or Pulling Monocrystal Semiconductor Boules, Apparatus for Epitaxial Deposition on Semiconductor Wafers, Apparatus for wet Etching, Developing, Stripping or Cleaning Semiconductor Wafers or of Flat Panel Display Substrates, die Attach Apparatus and Tape Automated Bonders for Assembly of Semiconductor Devices and Encapsulation Equipment for Assembly of Semiconductor Devices, N.e.s. |
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CN 84799050 / Exports / Unit = Prices (Euro/ ton) / Partner: Netherlands / Reporter: European Union /84799050:Parts of Apparatus for Growing or Pulling Monocrystal Semiconductor Boules, Apparatus for Epitaxial Deposition on Semiconductor Wafers, Apparatus for wet Etching, Developing, Stripping or Cleaning Semiconductor Wafers or of Flat Panel Display Substrates, die Attach Apparatus and Tape Automated Bonders for Assembly of Semiconductor Devices and Encapsulation Equipment for Assembly of Semiconductor Devices, N.e.s. |
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CN 84799050 / Exports / Unit = Prices (Euro/ ton) / Partner: Germany / Reporter: European Union /84799050:Parts of Apparatus for Growing or Pulling Monocrystal Semiconductor Boules, Apparatus for Epitaxial Deposition on Semiconductor Wafers, Apparatus for wet Etching, Developing, Stripping or Cleaning Semiconductor Wafers or of Flat Panel Display Substrates, die Attach Apparatus and Tape Automated Bonders for Assembly of Semiconductor Devices and Encapsulation Equipment for Assembly of Semiconductor Devices, N.e.s. |
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CN 84799050 / Exports / Unit = Prices (Euro/ ton) / Partner: Italy / Reporter: European Union /84799050:Parts of Apparatus for Growing or Pulling Monocrystal Semiconductor Boules, Apparatus for Epitaxial Deposition on Semiconductor Wafers, Apparatus for wet Etching, Developing, Stripping or Cleaning Semiconductor Wafers or of Flat Panel Display Substrates, die Attach Apparatus and Tape Automated Bonders for Assembly of Semiconductor Devices and Encapsulation Equipment for Assembly of Semiconductor Devices, N.e.s. |
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CN 84799050 / Exports / Unit = Prices (Euro/ ton) / Partner: United Kingdom / Reporter: European Union /84799050:Parts of Apparatus for Growing or Pulling Monocrystal Semiconductor Boules, Apparatus for Epitaxial Deposition on Semiconductor Wafers, Apparatus for wet Etching, Developing, Stripping or Cleaning Semiconductor Wafers or of Flat Panel Display Substrates, die Attach Apparatus and Tape Automated Bonders for Assembly of Semiconductor Devices and Encapsulation Equipment for Assembly of Semiconductor Devices, N.e.s. |
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CN 84799050 / Exports / Unit = Prices (Euro/ ton) / Partner: Ireland / Reporter: European Union /84799050:Parts of Apparatus for Growing or Pulling Monocrystal Semiconductor Boules, Apparatus for Epitaxial Deposition on Semiconductor Wafers, Apparatus for wet Etching, Developing, Stripping or Cleaning Semiconductor Wafers or of Flat Panel Display Substrates, die Attach Apparatus and Tape Automated Bonders for Assembly of Semiconductor Devices and Encapsulation Equipment for Assembly of Semiconductor Devices, N.e.s. |
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CN 84799050 / Exports / Unit = Prices (Euro/ ton) / Partner: Denmark / Reporter: European Union /84799050:Parts of Apparatus for Growing or Pulling Monocrystal Semiconductor Boules, Apparatus for Epitaxial Deposition on Semiconductor Wafers, Apparatus for wet Etching, Developing, Stripping or Cleaning Semiconductor Wafers or of Flat Panel Display Substrates, die Attach Apparatus and Tape Automated Bonders for Assembly of Semiconductor Devices and Encapsulation Equipment for Assembly of Semiconductor Devices, N.e.s. |
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