85438973 (01/1998-12/2006) Electrical encapsulation equipment for assembly of semiconductor devices

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CN 85438972 / Exports / Unit = Prices (Euro/ ton) / Partner: France / Reporter: Eur27 /85438972:Electrical Apparatus for Physical Deposition on Semiconductor Wafers (Other Than by Sputtering)
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CN 85438972 / Exports / Unit = Prices (Euro/ ton) / Partner: Belgium/ Luxembourg / Reporter: Eur27 /85438972:Electrical Apparatus for Physical Deposition on Semiconductor Wafers (Other Than by Sputtering)
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CN 85438972 / Exports / Unit = Prices (Euro/ ton) / Partner: Netherlands / Reporter: Eur27 /85438972:Electrical Apparatus for Physical Deposition on Semiconductor Wafers (Other Than by Sputtering)
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CN 85438972 / Exports / Unit = Prices (Euro/ ton) / Partner: Germany / Reporter: Eur27 /85438972:Electrical Apparatus for Physical Deposition on Semiconductor Wafers (Other Than by Sputtering)
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CN 85438972 / Exports / Unit = Prices (Euro/ ton) / Partner: Italy / Reporter: Eur27 /85438972:Electrical Apparatus for Physical Deposition on Semiconductor Wafers (Other Than by Sputtering)
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CN 85438972 / Exports / Unit = Prices (Euro/ ton) / Partner: United Kingdom / Reporter: Eur27 /85438972:Electrical Apparatus for Physical Deposition on Semiconductor Wafers (Other Than by Sputtering)
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CN 85438972 / Exports / Unit = Prices (Euro/ ton) / Partner: Denmark / Reporter: Eur27 /85438972:Electrical Apparatus for Physical Deposition on Semiconductor Wafers (Other Than by Sputtering)
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CN 85438972 / Exports / Unit = Prices (Euro/ ton) / Partner: Spain / Reporter: Eur27 /85438972:Electrical Apparatus for Physical Deposition on Semiconductor Wafers (Other Than by Sputtering)
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